Adhesion in Microelectronics by K. L. Mittal, Tanweer Ahsan

By K. L. Mittal, Tanweer Ahsan

This complete e-book will offer either primary and utilized facets of adhesion concerning microelectronics in one and simply available resource. one of the issues to be lined include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of fabrics because it relates to adhesion
  • Surface cleansing because it relates to adhesion
  • Ways to enhance adhesion
  • Unraveling of interfacial interactions utilizing an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion  (metallized polymers)
  • Polymer adhesion to varied substrates
  • Adhesion of skinny films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of other dielectric materials
  • Delamination and reliability matters in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion dimension of skinny motion pictures and coatings

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M. Sondag, M. C, Raas, and F. J. Touwslager, A comparison between inelastic electron tunnelling and infrared reflection-absorption spectroscopy for vibrational surface analysis, Appl. , 47, 205–223 (1991). 39. S. Devdas and R. R. Mallik, Variations in carbonyl mode intensities in inelastic electron tunneling and multiple reflection absorption infrared spectroscopy. Part I: Effects due to the lead cover films for selected mono-carboxylic acids on alumina, Intl. J. Adhesion Adhesives, 20, 341–347 (2000).

2 Scribe Test The scribe test, also known as the scratch test or the stylus test, is another widely used qualitative or semi-quantitative method of adhesion measurement for rapid assessment and quality assurance. 2, in the scribe test, a spherically tipped scratching point (stylus) subjected to a normal load (Fn) is dragged across the coated surface by a tangential traction force (Ft). The minimum normal load, also known as the critical load (Fn,c) at which coating is delaminated is taken as the nominal adhesion parameter.

IETS has also been used to identify impurities accidentally incorporated into Metal-Oxide-Semiconductor (MOS) junctions during the fabrication process, illustrating its value as a diagnostic tool for materials used in the manufacture of microelectronic devices based on MOS technology [68]. As indicated above, IETS has the capability for probing SAMs adsorbed on a variety of surfaces, but inevitably, since corresponding spectra are recorded for samples having a relatively large junction area (of order 1 mm2), local information on specific bonding sites is averaged out.

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