Contamination-Free Manufacturing for Semiconductors and by Robert P. Donovan

By Robert P. Donovan

Spotting the necessity for more suitable keep an eye on measures within the production strategy of hugely sensitized semiconductor expertise, this sensible reference offers in-depth and complex remedy at the origins, systems, and disposal of numerous contaminants. It makes use of modern examples in accordance with the newest and processing equipment to demonstrate formerly unavailable effects and insights in addition to experimental and theoretical developments.

Ensures the correct tools essential to meet the criteria demonstrated within the 1997 nationwide know-how Roadmap for Semiconductors (NTRS)!

Summarizing up to date regulate practices within the undefined, Contamination-Free production for Semiconductors and different Precision Products:

  • Details the physics and chemistry at the back of the mechanisms resulting in contamination-induced mess ups
  • Considers debris and molecular contaminants, together with the total spectrum of mass-based contaminants
  • Outlines basic illness difficulties and aim regulate degrees
  • Reveals and provides suggestions to insufficient parts of dimension power and keep an eye on expertise
  • Clarifies major difficulties and judgements dealing with the by way of studying NTRS criteria and infection mechanisms

    Containing over seven hundred literature references, drawings, images, equations, and tables, Contamination-Free production for Semiconductors and different Precision items is a vital reference for electric and electronics, instrumentation, technique, production, improvement, illness keep watch over and caliber engineers; physicists; and upper-level undergraduate and graduate scholars in those disciplines.

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    Contamination-Free Manufacturing for Semiconductors and Other Precision Products

    Spotting the necessity for greater keep watch over measures within the production strategy of hugely sensitized semiconductor know-how, this functional reference presents in-depth and complex remedy at the origins, approaches, and disposal of various contaminants. It makes use of modern examples in accordance with the most recent and processing equipment to demonstrate formerly unavailable effects and insights besides experimental and theoretical advancements.

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    Extra resources for Contamination-Free Manufacturing for Semiconductors and Other Precision Products

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    In addition, the placement of the ISPM cannot interfere with the process operation. A common site chosen for locating an ISPM is in the vacuum pump line. Even here, however, the area in which particles are counted and sized is typically only a small fraction of the pump line cross section. Unfortunately, particle flows in the pump line are not well mixed so that even in this location delivering a representative sample to the ISPM is not assured. In addition, the pump line is removed from the wafer location where the measurement of particle concentration is of highest value.

    From W. C. Hinds, Aerosol Technology. Copyright 1982 by John Wiley & Sons, Inc. ) Off-Wafer Measurement of Contaminants 35 Figure 5 Increase of monotonic behavior of scattering cross section at large collection angles. (From Ref. ) B. Other On-Line Methods of Counting Particles There are a number of methods for measuring particles that use light scattering indirectly or differently than in the standard particle counters. One of these is the aerodynamic particle sizer, which uses a split laser light beam to measure the time of flight of a particle entrained in a known airflow (Fig.

    D. Jensen, C. Gross, and D. Mehta, “Mapping the Roadmap: New Industry Document Explores Defect Reduction Technology Challenges,” MICRO, January 1998. F. Lakhani, D. Dance, and R. 25 Micron Integrated Circuit Yield Model Design and Validation,” presented at the International IEEE Symposium on Semiconductor Manufacturing, San Francisco, October 1997. D. Dance, D. Jensen, and R. 25 µm and Beyond,” MICRO, March 1998. C. Weber, D. Jensen, and D. Hirleman, “Mapping the Roadmap: What Drives Defect Detection,” MICRO, June 1998.

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